Title of article
Laser Beam Backside Probing of CMOS Integrated Circuits
Author/Authors
Kasapi، Steven نويسنده , , Tsao، Chun-Cheng نويسنده , , Wilsher، Ken نويسنده , , Lo، William نويسنده , , Somani، Seema نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1999
Pages
-956
From page
957
To page
0
Abstract
We have developed a new, fully integrated circuit timing analysis tool that provides measurements of electrical waveforms by direct access to the diffusion nodes through the backside of CMOS integrated circuits. The system, known as the IDS 2000, allows the device to be driven at full speed by a wide variety of testers. Utilising an actively modelocked infrared laser beam, the system can detect waveforms with ultrahigh bandwidth (~ 10 GHz) from CMOS devices using stroboscopic sampling. The system has proven to be an powerful tool for design debug and failure analysis of flip chip packaged IC as well as any other packaged IC where the silicon side can be thinned and directly accessed. © 1999 Elsevier Science Ltd. All rights reserved.
Keywords
Electromigration , Microstructural analysis , Aluminum alloys , Resistance measurements
Journal title
MICROELECTRONICS RELIABILITY
Serial Year
1999
Journal title
MICROELECTRONICS RELIABILITY
Record number
13056
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