Title of article :
Device reliability and robust power converter development
Author/Authors :
Keskar، N. نويسنده , , Trivedi، M. نويسنده , , Shenai، K. نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1999
Abstract :
This paper describes a top-down approach to reliability investigation of power electronic systems used in terrestrial and space applications. Results obtained from several case studies are presented that describe in detail both short-term and field failures of high-power DC-DC and AC-DC converters and the causes there-in. A systematic approach is presented that can be used to correlate field failures of power converters to residual defects and contaminants left in the semiconductor power switch, packaging and thermal management. Techniques and strategies that need to be applied in developing robust power converters for the next millennium are also outlined. © 1999 Elsevier Science Ltd. All rights reserved.
Keywords :
Electromigration , Resistance measurements , Microstructural analysis , Aluminum alloys
Journal title :
MICROELECTRONICS RELIABILITY
Journal title :
MICROELECTRONICS RELIABILITY