Title of article
Lifetime Extrapolation for IGBT Modules under Realistic Operation Conditions
Author/Authors
Fantini، F. نويسنده , , Ciappa، M. نويسنده , , Malberti، P. نويسنده , , Fichtner، W. نويسنده , , Cova، P. نويسنده , , Cattani، L. نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1999
Pages
-1130
From page
1131
To page
0
Abstract
In this paper a systematic approach is presented for extrapolating the lifetime due to bond wire lift-off in IGBT modules submitted to cyclic loading. Application profiles of the device are considered, as they are usually encountered in real current converters for railway traction systems. The proposed lifetime prediction scheme is based on the principle of the linear accumulation of the fatigue damage and takes into account the redundancy of the bond wires. © 1999 Elsevier Science Ltd. All rights reserved.
Keywords
Electromigration , Aluminum alloys , Resistance measurements , Microstructural analysis
Journal title
MICROELECTRONICS RELIABILITY
Serial Year
1999
Journal title
MICROELECTRONICS RELIABILITY
Record number
13110
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