• Title of article

    Reliability of radio frequency/microwave power packages: the effects of component materials and assembly processes

  • Author/Authors

    Fabis، Philip M. نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 1999
  • Pages
    -1264
  • From page
    1265
  • To page
    0
  • Abstract
    Mechanism of radiation effects in semiconductor (GaAs) is described. Analytic and numerical (equivalent circuit and quasi-hydrodynamic methods) models of ionizing irradiation influence on semiconductor devices are discussed. The GaAs microwave MESFET was selected as the investigation object. The combination of the quasihydrodynamic and equivalent circuits methods should provide a possibility to take into account all essential effects and at the same time to save the computation time in comparison with Monte Carlo method. © 1999 Published by Elsevier Science Ltd. All rights reserved.
  • Keywords
    Electronics , Microwave , Power , Reliability , Ceramic , Package
  • Journal title
    MICROELECTRONICS RELIABILITY
  • Serial Year
    1999
  • Journal title
    MICROELECTRONICS RELIABILITY
  • Record number

    13139