Title of article
Reliability of radio frequency/microwave power packages: the effects of component materials and assembly processes
Author/Authors
Fabis، Philip M. نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1999
Pages
-1264
From page
1265
To page
0
Abstract
Mechanism of radiation effects in semiconductor (GaAs) is described. Analytic and numerical (equivalent circuit and quasi-hydrodynamic methods) models of ionizing irradiation influence on semiconductor devices are discussed. The GaAs microwave MESFET was selected as the investigation object. The combination of the quasihydrodynamic and equivalent circuits methods should provide a possibility to take into account all essential effects and at the same time to save the computation time in comparison with Monte Carlo method. © 1999 Published by Elsevier Science Ltd. All rights reserved.
Keywords
Power , Package , Ceramic , Reliability , Microwave , Electronics
Journal title
MICROELECTRONICS RELIABILITY
Serial Year
1999
Journal title
MICROELECTRONICS RELIABILITY
Record number
13140
Link To Document