Modeling and microstructural characterization of incubation, time-dependent drift and saturation during electromigration in AI-Si-Cu stripes

The electromigration performance of Cu metalization has been reviewed with an explanation as to why the advantage of Cu over Al alloys in the fine line regime is not as great as anticipated. Cu metalization testing procedures are described and the dangers of "overstressing" are explained in some detail, . 1999 Elsevier Science Ltd. All rights reserved.