Early electromigration effects and early resistance changes

This paper reviews different known physical phenomena acting during electromigration, such as changes in the mechanical stress of the metal line, void growth and precipitation/dissolution of alloy elements (Cu, Si) and their effects on early resistance changes. The superposition of all these phenomena is also discussed to describe the typical early resistance changes detected in AI-Cu lines of the present technology, 1999 Elsevier Science Ltd. All rights reserved.