Pressure drop in riser and evaporator in an advanced two-phase thermosyphon loop

This study presents an experimental investigation of pressure drop in the evaporators and the riser of an advanced thermosyphon loop. The thermosyphon was designed for the cooling of three parallel high heat flux electronic components. The tested evaporators were made from small blocks of copper in which 7, 5, 4, 3, 2, 1 vertical channels with the diameters of 1.1, 1.5, 1.9, 2.5, 3.5 and 6 mm, respectively, and a length of 14.6 mm were drilled. Tests were done with isobutane at heat fluxes ranging between 22.4 and 303 kW/m2. For prediction of the pressure drop, in the riser, different combinations of frictional pressure drop and void fraction correlations were tested. Regarding the evaporator a simple correlation based on a homogeneous model [M.B. Bowers, I. Mudawar, Two-phase electronic cooling using mini-channel and macro-channel heat-sinks—part II, flow rate and pressure drop constraints, ASME J Electron Packaging 116 (1994) 298–305. [1]] has been used to predict the pressure drop.