Residual strength distribution of impacted glass/epoxy laminates with embedded shape memory alloy at low temperature

This paper evaluated the strength reduction and probabilistic behaviors of the residual flexural strength for impacted glass/epoxy laminates with embedded shape memory alloy (SMA) wires at various temperatures. A series of impact tests were performed on base (glass/epoxy laminates without SMA wires) and SMA laminates (glass/epoxy laminates with embedded SMA wires) at temperatures of 293 K, 263 K and 233 K. Three point flexural tests were then carried out so as to investigate the post-impact strength at the aforementioned temperatures. Strength reduction behavior of impacted laminates could be described by Caprino’s residual strength prediction model. A probabilistic model was developed in order to estimate the variation in residual strength of the impacted laminates with temperature. As the temperature decreased, the variation in residual strength increased due to the embrittlement of the constituent materials of the laminates at lower temperatures. When compared to the base laminates, the SMA laminates exhibited a higher variation in residual strength, especially at lower temperatures.