Title of article :
Correlating TEM images of damage in irradiated materials to molecular dynamics simulations
Author/Authors :
Schaeublin، نويسنده , , R. and Caturla، نويسنده , , M.-J. and Wall، نويسنده , , M. and Felter، نويسنده , , T. and Fluss، نويسنده , , M. and Wirth، نويسنده , , B.D. and Diaz de la Rubia، نويسنده , , T. and Victoria، نويسنده , , M.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2002
Pages :
5
From page :
988
To page :
992
Abstract :
TEM image simulations are used to couple the results from molecular dynamics (MD) simulations to experimental TEM images. In particular we apply this methodology to the study of defects produced during irradiation. MD simulations have shown that irradiation of FCC metals results in a population of vacancies and interstitials forming clusters. The limitation of these simulations is the short time scales available, on the order of 100 s of picoseconds. Extrapolation of the results from these short times to the time scales of the laboratory has been difficult. We address this problem by two methods: we perform TEM image simulations of MD simulations of cascades with an improved technique, to relate defects produced at short time scales with those observed experimentally at much longer time scales. On the other hand we perform in situ TEM experiments of Au irradiated at liquid-nitrogen temperatures, and study the evolution of the produced damage as the temperature is increased to room temperature. We find that some of the defects observed in the MD simulations at short time scales using the TEM image simulation technique have features that resemble those observed in laboratory TEM images of irradiated samples. In situ TEM shows that stacking fault tetrahedra are present at the lowest temperatures and are stable during annealing up to room temperature, while other defect clusters migrate one dimensionally above −100 °C. Results are presented here.
Journal title :
Journal of Nuclear Materials
Serial Year :
2002
Journal title :
Journal of Nuclear Materials
Record number :
1356756
Link To Document :
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