Development of Be/DSCu HIP bonding and thermo-mechanical evaluation

The hot isostatic pressing (HIP) joining condition and interlayer materials for Be and DSCu joining have been examined. Based on the screening test results, two HIP conditions and interlayer materials were selected for mock-up fabrication. The first technology uses an Al–Si–Mg foil inserted between the beryllium tile coated by an Al layer and the DSCu heat sink coated by an Al/Ti/Cu layer at the HIP temperature of 555 °C. Another technology uses a DSCu heat sink coated by a pure Cu layer at the HIP temperature of 620 °C. The latter technology provided the highest strength of the Be/DSCu joints. Heating tests at heat flux of 5 MW/m2 up to 1000 were performed to compare with thermo-mechanical performance. Though the HIP technology with the Al–Si–Mg foil had lower strength, the thermo-mechanical performance of the mock-up was better, than the performance of the mock-up with the pure Cu interlayer. The presence of the Al and Al–Si–Mg interlayers act as effective compliant layers between beryllium and DSCu.