Cladding technique for development of Ag–In–Cd decoupler

To develop a Ag (silver)–In (indium)–Cd (cadmium) alloy decoupler, a method is needed to bond the decoupler between two plates of the Al alloy (A6061-T6). We found that a better HIP condition was temperature, pressure and holding time at 803 K, 100 MPa and 1 h, respectively, for small test pieces (ϕ 22 mm in diam. × 5 mm in height). Especially, a sandwich case (a Ag–In plate with thickness of 0.5 mm between two Ag–Cd plates with thickness of 1.25 mm) gave easier (or better) bonding results. Though a hardened layer is found in the bonding layer, the rupture strength of the bonding layer is more than 30 MPa, which is higher than the design stress in our application.