Author/Authors :
Teshigawara، نويسنده , , M. and Harada، نويسنده , , M. and Saito، نويسنده , , S. and Oikawa، نويسنده , , K. and Maekawa، نويسنده , , F. and Futakawa، نويسنده , , M. and Kikuchi، نويسنده , , K. and Kato، نويسنده , , T. and Ikeda، نويسنده , , Y. and Naoe، نويسنده , , T. and Koyama، نويسنده , , T. and Ooi، نويسنده , , T. and Zherebtsov، نويسنده , , S. and Kawai، نويسنده , , M. and Kurishita، نويسنده , , H. and Konashi، نويسنده , , K.، نويسنده ,
Abstract :
To develop Ag (silver)–In (indium)–Cd (cadmium) alloy decoupler, a method is needed to bond the decoupler between Al alloy (Al5083) and the ternary Ag–In–Cd alloy. We found that a better HIP condition was temperature, pressure and holding time at 803 K, 100 MPa and 10 min. for small test pieces (ϕ22 mm in dia. × 6 mm in height). Hardened layer due to the formation of AlAg2 was found in the bonding layer, however, the rupture strength of the bonding layer is more than 30 MPa, the calculated design stress. Bonding tests of a large size piece (200 × 200 × 30 mm3), which simulated the real scale, were also performed according to the results of small size tests. The result also gave good bonding and enough required-mechanical-strength.
