Author/Authors :
Cassayre، نويسنده , , L. and Caravaca، نويسنده , , C. and Jardin، نويسنده , , R. and Malmbeck، نويسنده , , R. and Masset، نويسنده , , P. and Mendes، نويسنده , , E. and Serp، نويسنده , , J. and Soucek، نويسنده , , P. and Glatz، نويسنده , , J.-P.، نويسنده ,
Abstract :
U–Al alloy formation has been studied in the temperature range of 400–550 °C by electrochemical techniques in the molten LiCl–KCl eutectic. Cyclic voltammetry showed that underpotential reduction of U(III) onto solid Al occurs at a potential about 0.35 V more anodic than pure U deposition. Open circuit potential measurements, recorded after small depositions of U metal onto the Al electrode, did not allow the distinction between potentials associated with UAlx alloys and the Al rest potential, as they were found to be practically identical. As a consequence, a spontaneous chemical reaction between dissolved UCl3 and Al is thermodynamically possible and was experimentally observed. Galvanostatic electrolyses were carried out both on Al rods and Al plates. Stable and dense U–Al deposits were obtained with high faradic yields, and the possibility to load the whole bulk of a thin Al plate was demonstrated. The analyses (by SEM-EDX and XRD) of the deposits indicated the formation of different intermetallic phases (UAl2, UAl3 and UAl4) depending on the experimental conditions.