Dicopper(I) oxalate complexes as molecular precursors for the deposition of copper compounds

The synthesis, characterization, and thermal decomposition behavior of dicopper(I) oxalato complexes L4Cu2(C2O4) (L = CNtBu (2a), CNCMe2CH2tBu (2b), CNC6H3Me2-2,6 (2c)) is reported. 2c can be prepared in a straightforward manner by the reaction of stoichiometric amounts of Cu2O and oxalic acid with four equivalents of CNC6H3Me2-2,6, while those complexes with aliphatic isocyanides are better prepared from a copper(I) oxalato complex with alkine capping ligands (Me3SiCtriple bond; length of mdashCSiMe3)2Cu2(C2O4) (1) via ligand exchange. Crystallographic and spectroscopic evidence for 2a–c confirms the anticipated dinuclear structure with the oxalate in a μ-1,2,3,4 bridging mode and an essentially σ-character of the terminal isocyanides. In solid form the complexes are stable at room temperature and can be handled in air for some time. Their decomposition was studied by thermal gravimetric analysis coupled with mass spectrometry, and the degradation pathway was shown to depend on the type of isocyanide capping ligand. Decomposition of 2a,b takes place between 150 and 200 °C to give CuCN in a clean process that involves isobutene elimination from the terminal ligands, with elimination of (CN)2 and conversion to elemental copper at higher temperatures. Heating of 2c leads to CuO (and then to Cu2O) via release of the intact isocyanide, CO2, and CO in a well-behaved thermal process around 200–280 °C.