Title of article :
Deposition of amorphous fluorosilane thin film on silicon surface: Atomic simulation
Author/Authors :
Gou، نويسنده , , Fujun and Ming، نويسنده , , Xu and Weili، نويسنده , , Sun-Kang Chen، نويسنده , , T.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2007
Pages :
5
From page :
4186
To page :
4190
Abstract :
We utilized the Tersoff–Brenner potential form potential to investigate SiF3 continuously bombarding silicon surface with energies of 10, 50 and 100 eV at normal incidence and room temperature by molecular dynamics method. The saturation of deposition yield of F and Si atoms on the surface is observed. A F-containing amorphous layer is formed whose thickness increases with incident energy. In the ejected gas-phase species, F, SiF and SiF2 species increases with increasing incident energy, while the amount of SiF3 species decreases.
Keywords :
chemical vapor deposition , Plasma deposition , Modeling and simulation
Journal title :
Journal of Non-Crystalline Solids
Serial Year :
2007
Journal title :
Journal of Non-Crystalline Solids
Record number :
1381658
Link To Document :
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