Ultra-thin polycrystalline Si layers on glass prepared by aluminum-induced layer exchange

In this work, we present studies of ultra-thin polycrystalline silicon layers (5–100 nm) prepared by the aluminum-induced layer exchange process. Here, a substrate/Al/oxide/amorphous Si layer stack is annealed at temperatures below the eutectic temperature of the Al/Si system of 577 °C, leading to a layer exchange and the crystallization of the amorphous Si. We have studied the process dynamics and grain growth, as well as structural properties of the obtained polycrystalline Si thin films. Furthermore, we derive a theoretical estimate of the grain density and examine characteristic thermal activation energies of the process. The structural properties have been investigated by Raman spectroscopy. A good crystalline quality down to a layer thickness of 10 nm has been observed.