Title of article :
Evaluation of interfacial toughness curve of bimaterial in submicron scale
Author/Authors :
Do، نويسنده , , Van Truong and Hirakata، نويسنده , , Hiroyuki and Kitamura، نويسنده , , Takayuki and Vuong، نويسنده , , Van Thanh and Le، نويسنده , , Van Lich، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2012
Abstract :
A novel method combining the experimental data at only two different mixed mode fractures and an empirical interface toughness function has been proposed to establish the interfacial toughness function of a bimaterial in submicron scale. The modified four-point bend specimen was used in experiment to evaluate the first type of mixed mode fracture, while the sandwiched cantilever specimen was employed to get the second one. An empirical interface toughness function reflecting quite accurately the delamination behavior was adopted as a typical one. The obtained results investigated that the proposed method could be used to calibrate not only the interfacial fracture criteria at pure modes but also at any mixed mode fracture of bimaterials in submicron scale.
Keywords :
Interface strength , Fracture criterion , Interface toughness curve , Bimaterial , Thin film
Journal title :
International Journal of Solids and Structures
Journal title :
International Journal of Solids and Structures