Difference in subsurface damage in indented specimens with and without bonding layer

This paper aims to assess the applicability of the bonded–interface technique (BIT) that has been used for examining sub-surface damage in brittle materials. With the aid of the finite element method, the indentation stress fields in alumina specimens with and without a bonded–interface were analysed. It was found that the bonded–interface greatly alters the stress distribution in the neighbourhood of the interface. The high-stress zone shifts away from the interface, and extends to the surface. Both glue layer mechanical properties and bond thickness play a limited role in the overall stress field of the BIT alumina. Comparisons of theoretical predictions with experimental observations showed that, to a great extent, the BIT presents a different pattern of sub-surface damage. The study clarifies the applicability of the BIT and offers a useful guideline for practitioners.