Author/Authors :
Geetha، نويسنده , , M. and Kumar، نويسنده , , N. and Panda، نويسنده , , K. and Dhara، نويسنده , , S. and Dash، نويسنده , , S. and Panigrahi، نويسنده , , B.K. and Tyagi، نويسنده , , A.K. and Jayavel، نويسنده , , R. and Kamaraj، نويسنده , , V.، نويسنده ,
Abstract :
Cu films were deposited on Si substrates by direct current (DC) magnetron sputtering at three different substrate temperatures such as room temperature (RT), 100 °C and 200 °C. Possible mechanisms for substrate temperature dependent microstructure evolution in Cu films are discussed in this paper. Enhanced mechanical properties such as high hardness, high elastic modulus, low friction coefficient and high wear resistance of the films were obtained at deposition temperature of 100 °C. However, high friction coefficient as well as high wear rate was measured in films deposited at room temperature and 200 °C.
