Title of article
Highly accurate and quick bonding of a laser-diode chip onto a planar lightwave circuit
Author/Authors
Sawada، نويسنده , , R. and Higurashi، نويسنده , , E. and Ito، نويسنده , , T.، نويسنده ,
Issue Information
فصلنامه با شماره پیاپی سال 2001
Pages
8
From page
293
To page
300
Abstract
A method for accurately and quickly bonding a planar lightwaveguide circuit (PLC) and a laser diode is proposed. It is based on simultaneous auto-focusing on marks fabricated on the PLC and laser diode. Bonding equipment constructed to implement the method achieves alignment accuracy of ± 1 μm and greatly reduces the turn-around-time, i.e., the time from when the laser diode is picked up by the tweezers to completion of the bonding process.
Keywords
measuring , Infrared light , Optical elements , Lightwaveguide , Laser diode , Surface bonding , ALIGNMENT
Journal title
Precision Engineering
Serial Year
2001
Journal title
Precision Engineering
Record number
1428686
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