Wet release of multipolymeric structures with a nanoscale release layer

A promising wet release process using OmniCoat™ [1] has been developed for the release of the multilayer microsensor device that is being used for biomedical applications. OmniCoat™ has high thermal stability (Tg ∼190 °C) which makes it compatible with high temperature processes. A multilayer fabrication approach and OmniCoat™ release layer was successfully integrated for a microsensor device to be released from the substrate. Thickness and release rate of OmniCoat™ release layer was investigated. The effects of OmniCoat™ development on the optical properties of SU-8 were analyzed. Highly aligned structures and good adhesion between metals and cured polymer layers have been achieved. OmniCoat™ as a release layer has great potential in several other MEMS applications where SU-8 is used as a structural material.