• Title of article

    Surface modification-assisted bonding of polymer-based microfluidic devices

  • Author/Authors

    Myra T. and Tennico، نويسنده , , Yolanda H. and Koesdjojo، نويسنده , , Myra T. and Kondo، نويسنده , , Saki and Mandrell، نويسنده , , David T. and Remcho، نويسنده , , Vincent T.، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2010
  • Pages
    6
  • From page
    799
  • To page
    804
  • Abstract
    This paper reports on the development and application of a surface modification technique as an improved method for bonding polymer microfluidic substrates. This technique readily produced complete microfluidic chips via plasma oxidation followed by silane reagent treatment on the polymer surface. Characterization of the bonded chips was performed using scanning electron microscopy (SEM), water contact angle measurement, and tensile strength measurement. SEM images showed that the integrity of the channel features was successfully preserved. A bond strength approaching that of solvent welding was demonstrated. This technique has been successfully applied to bond dissimilar polymer substrates (polymethylmethacrylate (PMMA), amorphous polyethylene terephthalate (APET), polycarbonate (PC)), and is also applicable to bonding a hard polymer substrate to polydimethylsiloxane (PDMS) or glass.
  • Keywords
    Surface modification , Tetraethyl orthosilicate , Poly(methylmethacrylate) , Microfluidics , hot embossing , fabrication
  • Journal title
    Sensors and Actuators B: Chemical
  • Serial Year
    2010
  • Journal title
    Sensors and Actuators B: Chemical
  • Record number

    1438107