Evolution of microstructure and phase in amorphous, protocrystalline, and microcrystalline silicon studied by real time spectroscopic ellipsometry

Real time spectroscopic ellipsometry has been applied to develop deposition phase diagrams that can guide the fabrication of hydrogenated silicon (Si:H) thin films at low temperatures (<300°C) for highest performance electronic devices such as solar cells. The simplest phase diagrams incorporate a single transition from the amorphous growth regime to the mixed-phase (amorphous+microcrystalline) growth regime versus accumulated film thickness [the a→(a+μc) transition]. These phase diagrams have shown that optimization of amorphous silicon (a-Si:H) intrinsic layers by RF plasma-enhanced chemical vapor deposition (PECVD) at low rates is achieved using the maximum possible flow ratio of H2 to SiH4 that can be sustained while avoiding the a→(a+μc) transition. More recent studies have suggested that a similar strategy is appropriate for optimization of p-type Si:H thin films. The simple phase diagrams can be extended to include in addition the thickness at which a roughening transition is detected in the amorphous film growth regime. It is proposed that optimization of a-Si:H in higher rate RF PECVD processes further requires the maximum possible thickness onset for this roughening transition.