Laser patterning of P2 interconnect via in thin-film CIGS PV modules

The use of laser scribed Cu(In,Ga)Se2 as a high-speed and low-stress alternative to the standard mechanical scribing has been investigated for thin-film PV modules on glass substrates. Laser scribe lines were smooth, narrow and straight compared to the chipped and jagged mechanically scribed lines. Modules fabricated using laser patterning have reached a 15% module efficiency and fill factors as high as 73%. Contact resistances were found to be in the range of 0.1 Ω cm for standard scribing and 0.4 Ω cm for the laser-formed contacts. In spite of the elevated contact resistance performance is comparable to conventionally processed modules and dry heat stability tests are encouraging.