Study on silicon-slicing technique using plasma-etching processing

Recently, the demand for the low kerf-loss slice of the silicon wafer for photovoltaic cells is increasing from the point of view of saving raw materials. In this work, we studied the silicon-slicing technique using plasma-etching processing, which is thought to be promising to reduce the kerf loss. Finally, the slice conditions were optimized and slice speed and kerf loss were improved to about 1 μm/s and 150 μm, respectively.