Coupled thermoelasticity of functionally graded plates based on the third-order shear deformation theory

In this paper, the analytical solution is presented for a plate made of functionally graded materials based on the third-order shear deformation theory and subjected to lateral thermal shock. The material properties of the plate, except Poissonʹs ratio, are assumed to be graded in the thickness direction according to a power-law distribution in terms of the volume fractions of the constituents. The solution is obtained under the coupled thermoelasticity assumptions. The temperature profile across the plate thickness is approximated by a third-order polynomial in terms of the variable z with four unknown multiplier functions of (x,y,t) to be calculated. The equations of motion and the conventional coupled energy equation are simultaneously solved to obtain the displacement components and the temperature distribution in the plate. The governing partial differential equations are solved using the double Fourier series expansion. Using the Laplace transform, the unknown variables are obtained in the Laplace domain. Applying the analytical Laplace inverse method, the solution in the time domain is derived. Results are presented for different power law indices and the coupling coefficients for a plate with simply supported boundary conditions. The results are validated based on the known data for thermomechanical responses of a functionally graded plate reported in the literature.