On the influence of boron-addition on TLP bonding time in a Ni3Al-based intermetallic

Transient liquid phase (TLP) bonding of boron-bearing and boron-free single crystals of a Ni3Al-based intermetallic alloy IC 6 was performed to study the influence of boron addition to the base-material on isothermal solidification completion time, tf, required to prevent formation of deleterious joint centerline eutectic microconstituent. The result showed that addition of boron to the intermetallic alloy did not prohibitively prolong tf as predicted by theoretical TLP bonding models. The deviation from prediction is attributable to microsegregation behaviour of boron atoms during directional solidification of the cast alloy IC 6.