Title of article :
ENCAPSULATION IN TERNARY ELASTOMER BLENDS
Author/Authors :
KUSUKI، YASUAKI نويسنده , , LEE، MOO SUNG نويسنده , , MACOSKO، C. W. نويسنده ,
Issue Information :
فصلنامه با شماره پیاپی سال 1999
Pages :
-108
From page :
109
To page :
0
Abstract :
Ternary clastomer hiends uf acrylonitrile-butadiene rubber (NBR), chlorinated polyethylene (CM), and ethylenepropylene rubber (EP) have been investigated using transmission electron microscopy (TEM). Especially the effect of comonomer content, chlorine in CM and acrylonitrile in NBR, on blend morphology is sludied. The blend ratio of NBR/CM/EP is fixed at 10/20/70 by weight: EP acts as matrix and NBR and CM comprise dispersed phases. TEM Aobservation is possible without staining due to a natural contrast between NBR and CM. From TEM micrographs it is clear that NBR/CM/EP blends show encapsulated structures. Which component will be the encapsulating layer depends on comonomer contents. For blends containing high acrylonitrilc content (NBR46), CM forms the encapsulating layer: wherease, for blends with low acrylonitrile (NBR16), NBR16 encapsulates CM. The encapsulation behavior of NBR/CM/EP blends is interpreted in terms of a spreading coefficient concept combined with solubility parameter and melt viscosity differences between NBR and CM. Our calculation based on simple thermodynamic considerations explains the morphology observed in this study except for the NBR 16/CM29/EP blend.
Keywords :
semiconductor manufacturing , dispatching , wafer fab.
Journal title :
Rubber Chemistry and Technology
Serial Year :
1999
Journal title :
Rubber Chemistry and Technology
Record number :
15919
Link To Document :
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