Silica gel containing sulfur, nitrogen and oxygen as adsorbent centers on surface for removing copper from aqueous/ethanolic solutions

Silica gel was modified firstly with aminepropyltrimethoxisilane obtaining the matrix named as SILNH2. The SILNH2 silica reacted subsequently with thioglycolic acid Sil-Ntga. The elemental analysis showed the presence of 0.98 mmol g−1 of organic moieties immobilized on silica. Infrared and 13C NMR spectroscopic data in conjunction with thermogravimetric measurements are in agreement with the suggested functionalization. The ion adsorption properties of the silica Sil-Ntga were studied using copper ions in aqueous/ethanolic solutions in concentrations ranging from 4.0×10−3 to 5.0×10−2 mol dm−3 at different temperatures. The new modified silica showed a good sorption ability for copper at lower temperatures and its reuse capacity was demonstrated.