Characterization of Pd–Cu membranes fabricated by surfactant induced electroless plating (SIEP) for hydrogen separation

Pd–Cu composite membranes on microporous stainless steel (MPSS) substrate were fabricated using surfactant induced electroless plating (SIEP). In the SIEP method, dodecyl trimethyl ammonium bromide (DTAB), a cationic surfactant, was used in Pd- and Cu-baths for the sequential deposition of metals on MPSS substrates. The SIEP Pd–Cu membrane performance was compared with membranes fabricated by conventional electroless plating (CEP). The pre- and post-annealing characterizations of these membranes were carried out by SEM, XRD, EDX and AFM studies. The SEM images showed a significant improvement of the membrane surface morphology, in terms of metal grain structures and grain agglomeration compared to the CEP membranes. The SEM images and helium gas-tightness studies indicated that dense and thinner films of Pd–Cu can be produced with shorter deposition time using SIEP method. From XRD, cross-sectional SEM and EDS studies, alloying of Pd–Cu was confirmed at an annealing temperature of 773 K under hydrogen environment. These membranes were also studied for H2 perm-selectivity as a function of temperature and feed pressure. SIEP membranes had significantly higher H2 perm-selectivity compared to CEP membranes. Under thermal cycling (573 K – 873 K – 573 K), the SIEP Pd–Cu membrane was stable and retained hydrogen permeation characteristics for over three months of operation.