Validation of thermodesorption method for analysis of semi-volatile organic compounds adsorbed on wafer surface

To prevent the degradation of the device characteristics it is important to detect the organic contaminants adsorbed on the wafers. In this respect, a reliable qualitative and quantitative analytical method for analysis of semi-volatile organic compounds which can adsorb on wafer surfaces is of paramount importance. we present a new analytical method based on Wafer Outgassing System (WOS) coupled to Automated Thermal Desorber–Gas chromatography–Mass spectrometry (ATD–GC–MS) to identify and quantify volatile and semi-volatile organic compounds from 6", 8" and 12" wafers. chnique allows the desorption of organic compounds from one side of the wafers. This method was tested on three important airborne contaminants in cleanroom i.e. tris-(2-chloroethyl) phosphate (TCEP), tris-(2-chloroisopropyl) phosphate (TCPP) and diethyl phthalate (DEP). ition, we validated this method for the analysis and quantification of DEP, TCEP and TCPP and we estimated the backside organic contamination which may contribute to the front side of the contaminated wafers. demonstrating that WOS/ATD–GC–MS is a suitable and highly efficient technique for desorption and quantitative analysis of organophosphorous compounds and phthalate ester which could be found on the wafer surface.