Title of article
Electrochemical adsorption studies of urea on copper surface in alkaline medium
Author/Authors
Altaf، نويسنده , , Fouzia and Qureshi، نويسنده , , Rumana and Ahmed، نويسنده , , Safeer Hussain Khan، نويسنده , , Athar Y. and Naseer، نويسنده , , Amtul، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2010
Pages
4
From page
98
To page
101
Abstract
The inhibitive action of urea on the corrosion behavior of copper was investigated in borate buffer pH (8.4) by means of cyclic voltammetry and electrochemical impedance spectroscopy (EIS). A consistent trend of increase in inhibition efficiency was observed as a function of concentration of urea. The adsorption of urea on copper surface was found to obey the Langmuir adsorption isotherm with ΔG = −35.2 kJ/mole and adsorption constant K = 2.7 × 104 dm3/mole. Impedance spectroscopic measurements confirmed that charge transfer resistance increases in presence of urea upon increasing its concentration.
Keywords
Copper , Cyclic voltammetry , EIS , Adsorption
Journal title
Journal of Electroanalytical Chemistry
Serial Year
2010
Journal title
Journal of Electroanalytical Chemistry
Record number
1674231
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