Title of article
The kinetics of formation and structure of an underlayer alloy: the Cu(1 0 0)-c(2×2)–Pd system
Author/Authors
Barnes، نويسنده , , C.J and AlShamaileh، نويسنده , , E and Pitkنnen، نويسنده , , T and Kaukasoina، نويسنده , , P and Lindroos، نويسنده , , M، نويسنده ,
Issue Information
هفته نامه با شماره پیاپی سال 2001
Pages
12
From page
55
To page
66
Abstract
The kinetics and mechanism of an irreversible overlayer to underlayer transition in the Cu(1 0 0)-c(2×2) surface alloy has been investigated by LEED. The activation energy for Pd site switching from the outermost layer to sub-surface (second layer) sites has been estimated to be 109±12 kJ mol−1 (1.13±0.12 eV).
ructure of the underlayer alloy has been examined quantitatively by tensor LEED. The Cu(1 0 0)-c(2×2) underlayer is demonstrated to have its origin in substitution of approximately 0.5 ML of Pd into the second layer to form a c(2×2) CuPd underlayer alloy capped by a copper monolayer (Rp=0.28). A mixed third layer c(2×2) CuPd layer capped by a copper double layer may be ruled out. Incorporation of sub-surface Pd into the Cu(1 0 0) surface leads to significant expansion of both the first and second interlayer spacings of Δdz12=+3.3% (0.06 Å) and ΔDz23=+6.6% (0.12 Å) relative to the bulk Cu(1 0 0) interlayer spacing (1.805 Å) leading to a net expansion of the outermost three layer slab of 0.18 Å.
Keywords
surface structure , and topography , Metal–metal interfaces , Roughness , Low energy electron diffraction (LEED) , Single crystal epitaxy , morphology , Alloys , Electron–solid interactions , PALLADIUM , Copper
Journal title
Surface Science
Serial Year
2001
Journal title
Surface Science
Record number
1678081
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