• Title of article

    The kinetics of formation and structure of an underlayer alloy: the Cu(1 0 0)-c(2×2)–Pd system

  • Author/Authors

    Barnes، نويسنده , , C.J and AlShamaileh، نويسنده , , E and Pitkنnen، نويسنده , , T and Kaukasoina، نويسنده , , P and Lindroos، نويسنده , , M، نويسنده ,

  • Issue Information
    هفته نامه با شماره پیاپی سال 2001
  • Pages
    12
  • From page
    55
  • To page
    66
  • Abstract
    The kinetics and mechanism of an irreversible overlayer to underlayer transition in the Cu(1 0 0)-c(2×2) surface alloy has been investigated by LEED. The activation energy for Pd site switching from the outermost layer to sub-surface (second layer) sites has been estimated to be 109±12 kJ mol−1 (1.13±0.12 eV). ructure of the underlayer alloy has been examined quantitatively by tensor LEED. The Cu(1 0 0)-c(2×2) underlayer is demonstrated to have its origin in substitution of approximately 0.5 ML of Pd into the second layer to form a c(2×2) CuPd underlayer alloy capped by a copper monolayer (Rp=0.28). A mixed third layer c(2×2) CuPd layer capped by a copper double layer may be ruled out. Incorporation of sub-surface Pd into the Cu(1 0 0) surface leads to significant expansion of both the first and second interlayer spacings of Δdz12=+3.3% (0.06 Å) and ΔDz23=+6.6% (0.12 Å) relative to the bulk Cu(1 0 0) interlayer spacing (1.805 Å) leading to a net expansion of the outermost three layer slab of 0.18 Å.
  • Keywords
    surface structure , and topography , Metal–metal interfaces , Roughness , Low energy electron diffraction (LEED) , Single crystal epitaxy , morphology , Alloys , Electron–solid interactions , PALLADIUM , Copper
  • Journal title
    Surface Science
  • Serial Year
    2001
  • Journal title
    Surface Science
  • Record number

    1678081