Title of article
X-ray diffraction analysis of the silicon (111) surface during alkaline etching
Author/Authors
Shah، نويسنده , , I.A. and Nguyen، نويسنده , , Q.D. and Philipsen، نويسنده , , H.G.G. and van der Wolf، نويسنده , , B.M.A. and Algra، نويسنده , , R.G. and Tinnemans، نويسنده , , P. and Koekkoek، نويسنده , , A.J. and Panina، نويسنده , , N. and van den Bruele، نويسنده , , F.J.M. and van Enckevort، نويسنده , , W.J.P. and Vlieg، نويسنده , , E.، نويسنده ,
Issue Information
هفته نامه با شماره پیاپی سال 2011
Pages
7
From page
1027
To page
1033
Abstract
We present a surface X-ray diffraction determination of the silicon (111)-liquid interface structure during alkaline etching. Preparation of an atomically smooth surface was realized by an in-situ procedure using an aqueous NH4F solution devoid of oxygen. Using diluted aqueous potassium hydroxide (KOH) and ammonium fluoride (NH4F) etchant, we have observed that the crystal surface is hydrogen terminated and is not reconstructed at open circuit potential. In addition, a partial liquid ordering of two water layers on top of the crystal surface was found, indicating a weak interaction with the hydrophobic, hydrogen terminated surface. We have followed in-situ the development of the oxide layer by a birth and spread mechanism during anodic passivation of the silicon surface.
Keywords
Surface termination , Interface structure , Alkaline etching , Surface X-ray diffraction , Silicon
Journal title
Surface Science
Serial Year
2011
Journal title
Surface Science
Record number
1686073
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