Title of article
Effective diffusivity of lead free solder alloys
Author/Authors
Li، نويسنده , , Shidong and Basaran، نويسنده , , Cemal، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2009
Pages
8
From page
71
To page
78
Abstract
A Monte Carlo simulation based algorithm is developed to compute the effective diffusivity of lead free solder alloys. Simulations are performed to determine the vacancy diffusivity for 95.5Sn–4.0Ag–0.5Cu (SAC405) solder alloy for different paths. Temperature and micro-structural influence on diffusivity are studied. A map of diffusivity versus temperature and average grain size is developed. Significant differences between diffusivity values reported in the literature for the same solder alloy is also discussed.
Keywords
Monte Carlo , Effective diffusivity , Lead free solder alloys , Multi-Scale Modeling
Journal title
Computational Materials Science
Serial Year
2009
Journal title
Computational Materials Science
Record number
1686934
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