Simulation of dynamic recrystallization in solder interconnections during thermal cycling

In the present study, an algorithm, combining the Potts model based Monte Carlo (MC) and finite element methods, is developed in order to predict the dynamic recrystallization of tin in tin-rich lead-free solder interconnections during thermal cycling. A correlation between real time and MC simulation time is established. The phenomenon that intermetallic particles provide favorable sites for nucleation of new tin grains in solder matrix is also simulated. It is demonstrated that the present algorithm predicts the incubation period of the recrystallization as well as the growth tendency of the recrystallized regions, in a way consistent with the experimental findings. This quantitative description of the microstructural changes will contribute significantly to the reliability studies of solder interconnections.