Title of article
The adsorption and dissociation of O2 molecular precursors on Cu: the effect of steps
Author/Authors
Xu، نويسنده , , Ye and Mavrikakis، نويسنده , , Manos، نويسنده ,
Issue Information
هفته نامه با شماره پیاپی سال 2003
Pages
14
From page
219
To page
232
Abstract
The adsorption and dissociation of dioxygen on Cu steps are studied using periodic self-consistent density functional theory (PW91-GGA) calculations. Cu steps are modeled with a Cu(2 1 1) surface. The results are compared with those on the flat Cu(1 1 1) surface. The adsorption of both atomic and molecular oxygen is enhanced on the stepped surface: the binding energy of atomic oxygen is −4.5 eV at its preferred site on the relaxed Cu(2 1 1) surface vs. −4.3 eV at its preferred site on the relaxed Cu(1 1 1) surface, and the binding energy of the molecular oxygen precursor is increased from ∼−0.6 to ∼−1.0 eV. Several possible O2 dissociation paths at the edge of the Cu(2 1 1) step have been investigated. The activation energies range from 0.09 to 0.24 eV, comparable to a minimum activation energy of 0.20 eV found on Cu(1 1 1). However, compared to Cu(1 1 1) the paths on Cu(2 1 1) are stabilized in their entirety by the step by ∼0.5 eV in terms of initial state, transition state, and final state energies. The dissociation of O2 precursors at the foot of the step is close to being barrier-less. Because of the small dissociation barrier on Cu(1 1 1), the effect of steps on O2 dissociation is nevertheless not expected to be as pronounced as in other gas/metal systems.
Keywords
Metal–semiconductor interfaces , Corrosion , Copper , Oxygen , Oxidation , Density functional calculations , Surface defects , Catalysis
Journal title
Surface Science
Serial Year
2003
Journal title
Surface Science
Record number
1696316
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