Title of article :
Physico-chemical analysis on chemical bonding at adhesion interface between rubber and Pd alloy
Author/Authors :
Ikeda، نويسنده , , Yoshiyuki and Nawafune، نويسنده , , Hidemi and Mizumoto، نويسنده , , Shozo and Sasaki، نويسنده , , Muneo and Nagatani، نويسنده , , Asahiro and Nishimori، نويسنده , , Akihito and Yamaguchi، نويسنده , , Koichi and Uchida، نويسنده , , Ei and Okada، نويسنده , , Takashi، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2003
Pages :
4
From page :
231
To page :
234
Abstract :
Some spectroscopic analyses were carried out on the adhesive interface layers formed by cure-adhesion of natural rubber to electroless Pd and/or Pd–P alloys. The transmission electron microscopy revealed some clear images of the adhesion layer just at the interface between rubber and electroless-plating films of Pd and/or Pd–P alloys. The content ratio of Pd/S analyzed by energy dispersive X-ray spectroscopy changed gradually along the depth at the rubber–metal interface layer for Pd alloy, but was kept almost constant irrespective of depth for Pd–P alloy.
Keywords :
Natural rubber , Cure-adhesion , Electroless Plating , Palladium alloy , Transmission electron microscopy , Analysis adhesion layer , PALLADIUM
Journal title :
International Journal of Adhesion and Adhesives
Serial Year :
2003
Journal title :
International Journal of Adhesion and Adhesives
Record number :
1698030
Link To Document :
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