Adhesive properties of silicone polymers on some typical opto-electronic substrates: influence of the network density

This study examines the influence of the microstructural properties of a silicone polymer network and the surface properties of opto-electronic substrates on the adhesive properties. hlighted the influence of the silicon network microstructure on the type of break between the silicon polymer and the substrate: from an adhesive to a cohesive break when the cross-links density decreases with some formulations that give rise to some typical behaviours. Finite element analysis was used to explain these behaviours. o showed that the quality of the interface evolves in function of the viscosity of the silicon polymer before cross-linking and the number of Si–H functions it has. A better adhesion on silicon polymer/silica than on silicon polymer/InP is ascribed to the chemical composition surface being similar to the chemical structure of the silicon polymers and to more favourable surface energies.