The preparation and performance of high-temperature adhesives for graphite bonding

Two kinds of high-temperature adhesives (HTAs) were prepared. One was composed of phenol-formaldehyde (PF) resin and boron carbide (PF+B4C), the other was composed of PF resin, B4C and fumed silica (PF+B4C+SiO2). Graphite materials were bonded by the above adhesives and heat-treated at temperatures ranging from 200 to 1500 °C. The joining strength was tested at room temperature. The results show that the graphite joints exhibit satisfactory bonding strength and that ceramics fillers show a marked property modification effect. The strength of graphite joints bonded by PF+B4C and PF+B4C+SiO2 adhesive and treated at 1500 °C are 9.3 and 17.1 MPa, respectively. The property modification mechanism of ceramics fillers is also discussed in this paper. A strong chemical bonding force is introduced at the bonding interface and the volume shrinkage is restrained, which can be responsible for the good adhesive properties of HTAs for graphite bonding.