Title of article :
Stress analysis of the adhesive resin layer in a reinforced pin-loaded joint used in glass structures
Author/Authors :
To، نويسنده , , Q.D. and He، نويسنده , , Q.-C. and Cossavella، نويسنده , , M. and Morcant، نويسنده , , K. and Panait، نويسنده , , A.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2009
Pages :
7
From page :
91
To page :
97
Abstract :
A reinforced pin-loaded joint used to assemble elements in a tempered glass structure consists of a steel bolt and a steel ring glued to a glass plate through an adhesive resin layer. The stiffness of a typical resin material is generally much lower than the stiffness of steel or glass. This fact leads us to make the assumption that the stress field in the adhesive resin layer is essentially due to the relative rigid displacements of the steel ring with respect to the glass plate. On the basis of this assumption, an analytical solution is obtained for the stresses in the adhesive resin layer. This solution is compared with and validated by the numerical results obtained by the finite element method.
Keywords :
C. Finite element stress analysis , C. Stress analysis , E. Joint design
Journal title :
International Journal of Adhesion and Adhesives
Serial Year :
2009
Journal title :
International Journal of Adhesion and Adhesives
Record number :
1698894
Link To Document :
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