Study on the curing process and shearing tests of die attachment by Ag-epoxy electrically conductive adhesive

In order to provide more experiences on the application of electrically conductive adhesive (ECA), die attachment performance of Ag-epoxy electrically conductive adhesive (Ag-ECA) was systematically investigated by shearing tests. The specimens used in the tests were prepared with different processes, paste thicknesses, and base metal with or without plating layers. The results of the shearing tests show that heating and cooling rates do not affect the adhesive strength evidently. Thinner Ag-ECA and Cu–Cu substrate-chip couples can provide higher shear strength. The effect of hygrothermal aging and thermal cycling on the adhesive strength is also carefully analyzed. Both processes make the decrease of the shear strength of the Ag-ECA. Compared with thermal cycling, moisture invasion have more damage to the die-attachment of Ag-ECA.