Performance and structural evolution of high-temperature organic adhesive for joining Al2O3 ceramics

High-temperature organic adhesive was prepared by using preceramic polymer V-PMS as matrix, B4C powder and low melting point glass powder as additives, and was successfully applied to join Al2O3 ceramic. The obtained adhesive exhibited outstanding heat-resistant property and bonding strength. The bonding strength of the adhesive treated at 200 °C, 400 °C and 600 °C were 18.6 MPa, 20.4 MPa and 13.0 MPa, respectively. When treated above 800 °C, the bonding strengths were higher than 40 MPa. Moreover, the structural evolution of the obtained adhesive was studied by FTIR, DSC and XRD analysis. The results indicated that, up to 600 °C, the preceramic polymer and the glass additive play important role in improving the bonding strength. Above 800 °C, the outstanding wetting property and chemical compatibility of B2O3 formed by the oxidation of B4C were mainly responsible for the excellent high-temperature bonding strengths.