Mechanical behavior of interlocking multi-stepped double scarf adhesive joints including void and disbond effects

Surface topographical effects on the mechanical behavior of interlocking multi-stepped double scarf adhesive joints under tensile load were studied. For this purpose, finite element analysis (FEA) of the joint geometry at 10 different step angles was carried out. In the second stage, the effects of substrate voids and adhesive delaminations on the interfacial strength were studied for the scarf angle of 32.2° by FEA simulation as well as experimentally. For the cases of the missing steps (voids) and delamination (absence of bonding induced by release agent) the ratios of maximum stresses (principal, von Mises, normal, shear and transverse) between the completely bonded and altered (void or delaminated) joints were compared with the failure load ratios for the same joints to interpret the mechanism of failure. The results revealed that except for the normal stress, the maximum stress ratios reach a maximum value and then decrease with increasing scarf angle. FEA analysis with the voids showed that the strength of the joint not only depends on their size, but also on their location in the joint. When the experimental results were compared with the FEA using the stress ratio between the unmodified (completely bonded) and modified (void or disbond) cases, the results indicated that the normal stress dominates the failure behavior of the 32.2° scarf angle joint. Comparison of the experimental results for the void, and disbond cases revealed that the disbond cases can possess higher joint strength in comparison to the void cases. This finding could not be predicted by FEA, and was attributed to the presence of friction at the interface subsequent to delamination.