Title of article :
Work of adhesion between resin composite cements and PEEK as a function of etching duration with sulfuric acid and its correlation with bond strength values
Author/Authors :
Sproesser، نويسنده , , Oliver and Schmidlin، نويسنده , , Patrick R. and Uhrenbacher، نويسنده , , Julia and Eichberger، نويسنده , , Marlis and Roos، نويسنده , , Malgorzata and Stawarczyk، نويسنده , , Bogna، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2014
Abstract :
AbstractObjective
tudy investigated the impact of sulfuric acid etching duration of PEEK on work of adhesion (WA) with resin composite cements, and compared additionally measured surface parameters to shear bond strength (SBS) results.
s
pecimens were fabricated and divided according to different etching times using 98% sulfuric acid (N=448/n=54): 0, 5, 15, 30, 60, 90, 120 or 300 s, respectively. The resin composite cements RelyX ARC, Variolink II and Clearfil SA Cement (N=54/n=18) were smoothed on a glass plate. The sessile drop method was applied in all contact-angle measurements; distilled water and diiodomethane served as testing liquids. Overall 1350 single contact angle measurements were performed. Thereafter, surface free energy (SFE), WA, interfacial tension (IFT) and spreading coefficient (SC) of all combinations between etched PEEK and resin composite cements were calculated. Data were statistically analysed using Kolmogorov–Smirnov, Shapiro–Wilk tests, descriptive statistics and two-/one-way ANOVA with post-hoc Scheffé test (p<0.05). Using Pearson correlation the association between SFE values and SBS results of a previous study was investigated.
s
ink II showed the lowest WA, followed by RelyX ARC and Clearfil SA Cement, respectively. Etching specimens for 60 s showed the lowest WA values while etching times between 0 s and 30 s, and 300 s showed higher results. WA values for groups etched for 90 s and 120 s showed no differences when compared to the 60 s groups. SFE and disperse percentage showed a positive correlation with SBS. A negative correlation was observed between SBS and polar percentage for etched PEEK, WA, IFT and SC.
sions
values do not allow statements about the bond between two materials to be made; other parameters must be taken into account. A waiver of conventional bond test methods is not possible.
Keywords :
PEEK , Sulfuric acid , Etching duration , Work of Adhesion
Journal title :
International Journal of Adhesion and Adhesives
Journal title :
International Journal of Adhesion and Adhesives