Title of article :
The surface tension and density of the Cu–Ag–In alloys
Author/Authors :
Fima، نويسنده , , Przemyslaw and Wiater، نويسنده , , Katarzyna and Kucharski، نويسنده , , Marian، نويسنده ,
Issue Information :
هفته نامه با شماره پیاپی سال 2007
Abstract :
The surface tension and the densities of the Cu–Ag–In alloys have been measured by means of the sessile drop method. The density of these alloys depends linearly on temperature in the case of all the investigated compositions. The surface tension shows a linear dependence on temperature except for the lowest temperatures. For most of the alloys, the surface tension at the lowest temperature is lower than that predicted by the straight line. The experimental values of the surface tension of the Cu–Ag–In alloys are compared with those computed from the model, and quite good agreement is observed.
Keywords :
Cu–Ag–In alloys , Surface Tension , Density , Lead-free solders
Journal title :
Surface Science
Journal title :
Surface Science