Title of article
A comparison of some imidazoles in the curing of epoxy resin
Author/Authors
Ham، نويسنده , , Young Rok and Kim، نويسنده , , Sun Hee and Shin، نويسنده , , Young-Jae and Lee، نويسنده , , Dong Ho and Yang، نويسنده , , Minhee and Min، نويسنده , , Ji Hye and Shin، نويسنده , , Jae-Sup Shin، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2010
Pages
4
From page
556
To page
559
Abstract
An epoxy-imidazole resin system was used to form an anisotropic conducting film (ACF) for electronic equipment applications. In this study, the curing behaviors of an epoxy resin with imidazole, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 1-methylimidazole, 2-ethyl-4(5)-methylimidazole, and 1-(2-cyanoethyl)-2-ethyl-4(5)-methylimidazole were investigated using differential scanning calorimetry (DSC), and the curing times were determined at 150 and 180 °C. The polymerization mechanism for the epoxy resin with imidazoles was examined, and the DSC results matched the mechanism. 2-Methylimidazole exhibited the fastest reaction time among the imidazoles used in this study.
Journal title
Journal of Industrial and Engineering Chemistry
Serial Year
2010
Journal title
Journal of Industrial and Engineering Chemistry
Record number
1708963
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