Title of article :
Synthesis of thermosetting poly(phenylene ether) containing allyl groups
Author/Authors :
Fukuhara، نويسنده , , Toshiaki and Shibasaki، نويسنده , , Yuji and Ando، نويسنده , , Shinji and Ueda، نويسنده , , Mitsuru، نويسنده ,
Issue Information :
دوهفته نامه با شماره پیاپی سال 2004
Abstract :
New thermosetting poly(2-allyl-6-methylphenol-co-2,6-dimethylphenol)s (3) have been developed by oxidative coupling copolymerization of 2-allyl-6-methylphenol (1) with 2,6-dimethylphenol (2), followed by thermal curing. Copolymerization was conducted in nitrobenzene in the presence of copper(I) chloride and pyridine as the catalyst under a stream of oxygen, producing high molecular weight copolymers (Mn∼50,000) with broad molecular weight distributions (Mw/Mn∼35). The structure of resulting copolymers 3 was characterized by IR, 1H, and 13C NMR spectroscopy. Cross-linking reactions of copolymers were carried out by thermal treatment in the absence or presence of a peroxide (3 wt%, 2,5-dimethyl-2,5-di(tert-butylperoxy)-3-butane). The 10% weight loss and glass transition temperatures of the cured copolymers were 436 °C in nitrogen and 235 °C, respectively after curing at 70 °C for 1 h and 300 °C for 1 h. The average refractive index of the cured copolymer (3b) film was 1.5407, from which the dielectric constant (ε) at 1 MHz was estimated as 2.6. The ε and dissipation factor of copolymer-films at 1 MHz were directly measured from their capacitances as 2.5–2.6 and 0.0015–0.0019, respectively.
Keywords :
dielectric properties , Low k materials , Oxidative coupling polymerization