High thermal stable thermoplastic–thermosetting polyimide film by use of asymmetric dianhydride (a-BPDA)

In order to obtain thermoplastic (before curing) and thermosetting (after curing) polyimides with high Tg for adhesive film, we prepared novel polyimides having phenylethynyl group in the side chain (44% of concentration of curing group) from asymmetric 2,3,3′,4′-biphenyltetracarboxylic dianhydride (a-BPDA), 3,4′-oxydianiline (3,4′-ODA) or 1,3-bis(4-aminophenoxy)benzene (1,3,4-APB) or 1,3-bis(3-aminophenoxy)benzene (1,3,3-APB), and 2,4-diamino-1-(4-phenylethynylphenoxy)benzene (mPDAp). Among three kinds of polymer, uncured polyimide of a-BPDA/1,3,4-APB; mPDAp had rather high Tg (265 °C, DMA) and thermoplasticity (E′ drop>103 at Tg). After curing reaction of phenylethynyl group, the Tg of the polyimide was increased dramatically (364 °C, DMA). The polyimide derived from 1,3,4-APB having less concentration of curing group (20%) was also prepared to improve further film flexibility and toughness.